In-mold grain application

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United States of America Patent

PATENT NO 9199407
APP PUB NO 20140287085A1
SERIAL NO

14223250

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Abstract

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An in-mold grain application system includes a forming machine and an adhesive applicator. The adhesive applicator is configured to apply adhesive to a cover stock sheet prior to the sheet entering the forming machine. A controller is connected to the adhesive applicator and configured to command the adhesive applicator and control the adhesive application to the sheet.

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Patent Owner(s)

Patent OwnerAddress
NYX INC36111 SCHOOLCRAFT LIVONIA MI 48150

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kanakamedala, Vijay Canton, US 1 0
Packett, Joseph E Canton, US 1 0

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