Method and apparatus for processing housing

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9198335
APP PUB NO 20130342977A1
SERIAL NO

13901729

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Abstract

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A method for processing a housing for devices such as electronic devices. A hairline is formed on an inner surface of an inmold mold. In addition, a hairline is formed on an inmold film. The inmold film is positioned inside the inmold mold and a housing representing the hairline of the inmold mold and the hairline of the inmold film together is formed using inmold injection molding.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Min-Su Incheon, KR 7 157
Han, Soon-Ho Gyeonggi-do, KR 6 31

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