Semiconductor circuit structure and process of making the same

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United States of America Patent

PATENT NO 9196623
APP PUB NO 20130264622A1
SERIAL NO

13603426

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Abstract

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A semiconductor circuit structure and process of making the same is provided in the present invention, comprising the steps of providing a substrate having a target layer and a hard mask layer, forming a patterned small core body group and a large core body group on the hard mask layer, forming a spacer material layer conformally on the substrate and the core body groups, forming filling bodies in each recess of the spacer material layer, performing a first etching process to remove exposed spacer material layer, using the filling bodies as a mask to perform a second etching process for patterning the hard mask layer, and using the patterned hard mask layer as a mask to perform a third etching process for patterning the conductive layer.

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Patent Owner(s)

Patent OwnerAddress
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATIONNO 18 LI-HSIN RD 1 HSINCHU SCIENCE PARK HSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Yi-Shiang Changhua County, TW 6 19
Lin, Shu-Cheng Taipei, TW 11 70
Wang, Zih-Song Hsinchu, TW 22 65

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