Wafer temperature measurement tool
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United States of America Patent
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Nov 24, 2015
Grant Date -
Sep 18, 2014
app pub date -
Mar 14, 2013
filing date -
Mar 14, 2013
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Abstract
A wafer temperature measurement tool for measuring the surface temperature of a semiconductor wafer. The tool can be used to measure temperature on different parts of the wafer to provide a high resolution temperature distribution map. The tool includes an internal calibrated weight that is slidably disposed within a tool body. A temperature sensor is attached to the bottom of the weight. Ceramic stands are attached to the bottom of the tool body. Gravity pulls down on the weight such that the temperature sensor contacts the wafer when the ceramic stands of the tool body are placed on the wafer.
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