CMP retaining ring with soft retaining ring insert
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United States of America Patent
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Nov 24, 2015
Grant Date -
Sep 25, 2014
app pub date -
Jun 3, 2014
filing date -
Oct 5, 2010
priority date (Note) -
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Abstract
A method of polishing a wafer with a wafer carrier adapted to further reduce the edge effect and allow a wafer to be uniformly polished across its entire surface, with a retaining ring made from very hard materials such as PEEK, PET or polycarbonate with a hardness in the range of 80 to 85 Shore D, while the inner surface or insert is made of polyurethane or other material with a hardness in the range of 85 to 95 Shore A.
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