Reducing wafer bonding misalignment by varying thermal treatment prior to bonding
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United States of America Patent
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Nov 17, 2015
Grant Date -
Oct 1, 2015
app pub date -
May 19, 2015
filing date -
Sep 6, 2013
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Abstract
A bonding layer of a first wafer article is thermally treated and a bonding layer of a second wafer article is thermally treated in accordance with first and second process parameters, respectively prior to bonding the first wafer article with the second wafer article. First and second grid distortion in the first and second wafer articles is measured and a difference is determined between the first and second grid distortions. A prediction is made for maintaining the difference within a prescribed tolerance. At least one of the first process parameters and the second process parameters is conditionally varied in accordance with the prediction. The thermal treating of the first and second wafer articles can then be performed with respect to another pair of the first and second wafer articles prior to bonding to one another through their respective bonding layers.
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