Substrate having etching mask and method for producing same
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United States of America Patent
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Nov 17, 2015
Grant Date -
Dec 19, 2013
app pub date -
Feb 8, 2012
filing date -
Feb 10, 2011
priority date (Note) -
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Abstract
Provided are a substrate with an etching mask which enables high definition patterning and a method of manufacturing the same. A photosensitive material is applied on a surface of a substrate, exposure and development of the photosensitive material are carried out to form a resist pattern, a DLC coating film is formed on the surface of the substrate and a surface of the resist pattern, and the DLC coating film formed on the resist pattern is separated together with the resist pattern to form a DLC pattern on the surface of the substrate.
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