Betavoltaic power converter die stacking
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 10, 2015
Grant Date -
Dec 1, 2011
app pub date -
May 28, 2010
filing date -
May 28, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A power converter comprises a first die and a second die. Each die comprises a semiconductor substrate comprising a junction for converting nuclear radiation particles to electrical energy, the junction of each semiconductor substrate comprising a first side and a second side, a first electrode comprising a nuclear radiation-emitting radioisotope deposited on the semiconductor substrate, the first electrode being electrically connected to the first side of the junction, and a second electrode deposited on the semiconductor substrate, the second electrode being electrically connected to the second side. A bond is formed between one of the first electrode or the second electrode of the first die and one of the first electrode or the second electrode of the second die, wherein the bond forms an electrical contact between the bonded electrodes.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2010 Application Filing Year
- H01L Class
- 16510 Applications Filed
- 13147 Patents Issued To-Date
- 79.64 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 3 Citation Count
- H01L Class
- 10.46 % this patent is cited more than
- 10 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 10, 2027 |
