Testing device and testing method thereof
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United States of America Patent
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Nov 10, 2015
Grant Date -
Jun 19, 2014
app pub date -
Nov 13, 2013
filing date -
Dec 17, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed are a testing device and a testing method thereof. The testing device includes a frame, a flexible multi-layer substrate and at least one electrical testing point. The frame is positioned corresponding to a chip. At least one electrical connecting point is formed on a surface of the chip. The flexible multi-layer substrate is fixed in the frame. The electrical testing point is corresponding to the electrical connecting point and formed on an upper surface of the flexible multi-layer substrate for contacting the electrical connecting point and performing an electrical test to the chip. Furthermore, the electrical connecting point or the electrical testing point is a bump.
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