Substrate with bump structure and manufacturing method thereof
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United States of America Patent
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Nov 3, 2015
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N/A
app pub date -
Oct 31, 2014
filing date -
Jul 25, 2014
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Abstract
A manufacturing method of a substrate with a bump structure, a copper layer is formed on a semiconductor substrate, and a nickel layer is formed on the copper layer. A bump structure is composed of the copper layer and the nickel layer, wherein the hardness of the bump structure after annealing process depends on the thickness of the nickel layer to meet the user's demand. The hardness of the bump structure meets the user's demand prevents a glass substrate from cracking when the substrate with the bump structure is bonded with the glass substrate.
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