MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 3, 2015
Grant Date -
Dec 27, 2012
app pub date -
Jul 5, 2012
filing date -
Dec 13, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder contains between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0,2 wt. % Mn; and a remainder of Sn.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully