Low profile cryopump
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 3, 2015
Grant Date -
Oct 24, 2013
app pub date -
Apr 20, 2012
filing date -
Apr 20, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Faster cool down time is achieved in a low profile cryopump by having heat transferred directly from the inlet louver to the first stage heat station through one or more tapered thermal busses, and by obviating the need of a thermal shield over the second stage cylinder of the expander by having second stage cryopanels that form a nested tent like structure, at least one of which, extends over the cylinder.
First Claim
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International Classification(s)
- 2012 Application Filing Year
- B01D Class
- 3342 Applications Filed
- 2873 Patents Issued To-Date
- 85.97 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B01D Class
- 0 % this patent is cited more than
- 10 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 3, 2027 |
