Method of manufacturing printed circuit board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9173300
APP PUB NO 20130313009A1
SERIAL NO

13603959

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method of manufacturing a printed circuit board (PCB) and the PCB are provided. The method includes: filling a resin in a via-hole formed at a substrate from one surface side of the substrate; emitting light for a predetermined period of time to the resin filled in the via-hole from the other surface side of the substrate; and applying another resin on the other surface of the substrate.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
HAESUNG DS CO LTDCHANGWON-SI

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jung, Youn-Kwon Changwon, KR 2 4
Kim, Sang-Kun Changwon, KR 1 1
Seol, Jeong-Hoon Changwon, KR 1 1

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Apr 27, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00