Edge launch transition for a printed circuit board
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United States of America Patent
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Oct 27, 2015
Grant Date -
N/A
app pub date -
Mar 9, 2012
filing date -
Mar 11, 2011
priority date (Note) -
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Abstract
An edge launch and fabrication method wherein spaced elongated slots are formed through a circuit board. The slots are plated at least along one side thereof connecting ground planes of the circuit board thus forming spaced edge plated regions. Circuit modules are produced by singulating the circuit board along a cut line offset outwardly from the plated slot sides to form an edge launch outwardly extending from and between the spaced edge plated regions.
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