Lead frame, semiconductor package including the lead frame, and method of manufacturing the lead frame

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United States of America Patent

PATENT NO 9171789
APP PUB NO 20140252580A1
SERIAL NO

13958980

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Abstract

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There is provided a lead frame including a plurality of plating layers formed on both an upper surface and a lower surface of a base material including a metal, wherein an upper outermost plating layer of an upper part of the lead frame is a silver plating layer including silver, and a lower outermost plating layer of a lower part of the lead frame is a gold plating layer including gold.

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Patent Owner(s)

Patent OwnerAddress
HAESUNG DS CO LTDCHANGWON-SI

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bae, In-Seob Changwon, KR 1 3
Park, Se-Chuel Changwon, KR 10 26
Shin, Dong-Il Changwon, KR 12 224

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