Quad flat non-leaded semiconductor package and fabrication method thereof
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United States of America Patent
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Oct 27, 2015
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app pub date -
Apr 27, 2011
filing date -
Apr 27, 2010
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Abstract
A method for fabricating a quad flat non-leaded (QFN) package includes: forming die pads and bump solder pads by pressing a metal plate, wherein each of the die pads and the bump solder pads has at least a cross-sectional area greater than another located underneath along its thickness dimension, thereby enabling the die pads and the solder pads to be securely embedded in an encapsulant. The method further includes removing the metal plate after forming the encapsulant so as to prevent the encapsulant from overflowing onto the bottom surfaces of the bump solder pads.
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