High thermal stability pellet compositions for thermal cutoff devices and methods for making and use thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 27, 2015
Grant Date -
Dec 19, 2013
app pub date -
Jun 14, 2013
filing date -
Jun 15, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present disclosure provides a pellet composition having enhanced thermal stability for use in a thermally-actuated, current cutoff device. Certain inorganic stability additive particles, such as silica, talc, and siloxane, can be mixed with one or more organic compounds to form a thermal pellet composition. A solid thermal pellet maintains its structural rigidity up to a transition temperature (Tf), but further has improved overshoot temperature ranges. Therefore, the improved thermal pellets have a maximum dielectric capability temperature (Tcap), above which the pellet composition may lose substantial dielectric properties and conducts current that is at least 50° C. greater than the Tf. In certain variations, maximum dielectric capability temperature (Tcap) is greater than or equal to about 380° C.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully