Negative-type photoresist composition for thick film and use thereof
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United States of America Patent
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Oct 27, 2015
Grant Date -
Apr 30, 2015
app pub date -
Mar 24, 2014
filing date -
Oct 25, 2013
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Abstract
The present invention relates to a negative-type photoresist composition for thick film, comprising: (A) 20 to 50 wt % of an alkali-soluble resin which is polymerized from a plurality of kinds of monomers, wherein the monomers includes compounds represented by formulas (1A) and (1B), and based on the weight ratio of the monomers to the alkali-soluble resin, the sum of the formula (1A) compound and the formula (1B) compound are 20 to 60%, and X of the formula (1A) and (1B) may be independently H, methyl or ethyl.
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