Low profile memory module
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United States of America Patent
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Oct 20, 2015
Grant Date -
Jun 5, 2014
app pub date -
Dec 2, 2013
filing date -
Dec 1, 2012
priority date (Note) -
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Abstract
An electronic component module according to an embodiment of the present invention includes a printed circuit board including a low-profile plug and at least one memory component thereon, and a connector for connecting the printed circuit board to a motherboard, the connector being mateable with the plug on the printed circuit board and having a z-height of no more than about 1.5 mm. The low-profile plug includes one hundred seventy pins and the number of pins allocated for VSS is no more than twenty-two and the number of pins allocated for VDD is no more than sixteen. Further, the low-profile plug includes an insulative portion protruding from a surface of the printed circuit board and having a “”-like or inverted “
”-like profile in its center. The connector includes two sub-connectors, and an insulative portion having a “
”-like or inverted “m”-like profile in the center.
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