Dual interface module and dual interface card having a dual interface module manufactured using laser welding
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United States of America Patent
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Oct 20, 2015
Grant Date -
Oct 16, 2014
app pub date -
Apr 16, 2013
filing date -
Apr 16, 2013
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Abstract
Dual interface modules, and methods for manufacturing the same, are described. A substrate layer is provided with at least one dual interface section. At least two first through-holes are formed in the substrate in each dual interface section. A first connection element is arranged in each first through-hole. Each first connection element is connected to a contact pad that is arranged on a first side of the substrate. Each first connection element is connected to a connection pad that is arranged on a second side of the substrate. At least one electronic element is arranged on the second side of the substrate in each dual interface section. Two second through-holes are formed in the substrate in each dual interface section. Two soldering pads with a first side and a second side are arranged on the second side of the substrate layer.
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