Composite LED package and its application to light tubes
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United States of America Patent
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Oct 20, 2015
Grant Date -
Jan 22, 2015
app pub date -
Jul 17, 2013
filing date -
Jul 17, 2013
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Abstract
A light emitting diode package includes a first lead frame, a second lead frame and an encapsulant. The first lead frame has a die deposition area on the top thereof for disposing LED die. The second lead frame has a contacting face on the top thereof for wire bonding. The die deposition area of the first lead frame has a first adhesion area such that the encapsulant is held by the first adhesion area when enclosing the top and bottom of the first and second lead frames. The light is emitted in all directions.
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