Compositions incorporating dielectric additives for particle formation, and methods of particle formation using same
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United States of America Patent
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Oct 20, 2015
Grant Date -
Apr 3, 2014
app pub date -
Aug 14, 2013
filing date -
Aug 14, 2013
priority date (Note) -
Withdrawn
status (Latency Note)
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Abstract
A method of forming particles that includes performing a strong force attenuation of a mixture to form pre-particles. The mixture including a base compound and a dielectric additive having an elevated dielectric constant dispersed therein. The pre-particles are then dielectrically spun in an electrostatic field to further attenuate the pre-particles and form the particles.
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International Classification(s)
- D01D:MECHANICAL METHODS OR APPARATUS IN THE MANUFACTURE....
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- C03B:MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR ....
- B05B:SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- D01F:CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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