Panel assembly having thin bondline with reduced edge stress
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United States of America Patent
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Oct 20, 2015
Grant Date -
N/A
app pub date -
Oct 31, 2011
filing date -
Oct 31, 2011
priority date (Note) -
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Abstract
A structure may include a first layer, a second layer, and an adhesive layer. The first layer may have a faying surface, a side edge, and a first coefficient of thermal expansion. The second layer may also have a faying surface, a side edge, and a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion. The adhesive layer may be interposed between the first and second faying surfaces. The faying surface of at least one of the first and second layers may include an edge treatment extending along at least a portion of a respective one of the side edges. The edge treatment may have an edge treatment length measured along a direction generally parallel to the faying surface and an edge treatment height measured along a direction generally perpendicular to the faying surface.
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