Method for producing a semiconductor module arrangement
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United States of America Patent
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Oct 13, 2015
Grant Date -
Jul 24, 2014
app pub date -
Jan 22, 2014
filing date -
Jan 24, 2013
priority date (Note) -
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Abstract
A method for producing a semiconductor module arrangement includes providing a semiconductor module and a printed circuit board. The semiconductor module has a circuit mount populated with a semiconductor chip, an adjustment device in a first relative position with respect to the circuit mount, and a plurality of electrical connections each of which has a free end. Each of the connections is routed through a different passage opening in the adjustment device. The printed circuit board is pushed onto the electrical connections by each of the free ends being inserted into a different contact opening in the printed circuit board. The adjustment device is moved to a second relative position, which is different from the first relative position, with respect to the circuit mount.
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