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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
GLOBALWAFERS CO LTD	NO 8 INDUSTRIAL EAST ROAD SCIENCE-BASED INDUSTRIAL PARK HSINCHU

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Libbert, Jeffrey L	O'Fallon, US	62	623
Young, Gregory A	O'Fallon, US	16	89

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Apr 13, 2027

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
October 13, 2015	US,9159596,B2   US9159596B2	GRANTED PATENT AS SECOND PUBLICATION
May 02, 2013	US,20130105539,A1   US20130105539A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9159596

Clamping apparatus for cleaving a bonded wafer structure

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