2D/3D analysis for abnormal tools and stages diagnosis

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9158867
APP PUB NO 20140100684A1
SERIAL NO

13647643

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Abstract

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A method for analyzing abnormalities in a semiconductor processing system provides performing an analysis of variance on a production history associated with each of a plurality of tools at each of a plurality of process steps for each of a plurality of processed wafers, and key process steps are identified. A regression analysis on a plurality of measurements of the plurality of wafers at each process step is performed and key measurement parameters are identified. An analysis of covariance on the key measurement parameters and key process steps, and the key process steps are ranked based on an f-ratio, therein ranking an abnormality of the key process steps. Further, the plurality of tools associated with each of the key process steps are ranked based on an orthogonal t-ratio associated with an analysis of covariance, therein ranking an abnormality each tool associated with the key process steps.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chao, Hui-Yun Zhubei, TW 9 60
Chen, Jui-Long Taichung, TW 12 72
Lin, Chin-Hsiang Hsinchu, TW 424 6439
Lin, Chun-Hsien Hsinchu, TW 286 2079
Mou, Jong-I Hsinpu Township, TW 55 447

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