Lead-free jointing material and method of producing the same
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United States of America Patent
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Oct 13, 2015
Grant Date -
Apr 15, 2010
app pub date -
Dec 20, 2007
filing date -
Dec 25, 2006
priority date (Note) -
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Abstract
The present invention provides a high-temperature lead-free solder alloy which has no variation in strength of the soldered portion and has an excellent balance between strength and soldering properties, and a method for producing the alloy. The present invention relates to a lead-free jointing material made of an alloy of two elements A and B selected from elements other than Pb, wherein the element A has a melting point higher than a melting point of the element B, wherein the alloy is an alloy which has a room-temperature stable phase composed of the element B and a room-temperature stable phase AmBn composed of the elements A and B (provided that m and n are specific numerals in accordance with an alloy constituting a stable phase at room temperature) and satisfies AxB1-x (provided that 0
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