Thermally controlled assembly
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United States of America Patent
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Oct 6, 2015
Grant Date -
May 9, 2013
app pub date -
Apr 19, 2011
filing date -
Apr 23, 2010
priority date (Note) -
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Abstract
A thermally controlled assembly having two parallel PCBs defining there between, and by the aid of a channel forming element, a channel in which air is forced, using a fan, to cool components in the channel. The fan has a cooling surface cooled by air from the fan and which is biased toward an element provided in a space below the cooling surface. The forced air also drawing air from outside the assembly through the space and into the channel to cool other elements provided in the space.
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