Flex-rigid printed wiring board and manufacturing method thereof
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United States of America Patent
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Oct 6, 2015
Grant Date -
Aug 23, 2012
app pub date -
Apr 30, 2012
filing date -
Sep 21, 2006
priority date (Note) -
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Abstract
A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board. The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness “tf” of the conductor layer on the base film formed in the flexible region and the average thickness “tR” of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf
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