Housing for accommodating an electronic circuit
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United States of America Patent
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Oct 6, 2015
Grant Date -
Sep 11, 2014
app pub date -
Nov 30, 2011
filing date -
Nov 30, 2011
priority date (Note) -
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Abstract
A housing for receiving an electronic circuit (4) having a plurality of components (5) having a carrier plate (7) and a housing cover (8) including a circumferentially enclosing wall (9) on the carrier plate (7) and a cover part (10) on the wall (9), which cover part (10) lies opposite the carrier plate (7). A volume compensation element (11) is attached on the carrier plate (7) in an interior (12) of the housing cover (8) which is enclosed in a pressure-tight manner from an external atmosphere. The volume compensation element (11) is elastically formed providing a variable volume for compensation of pressure fluctuations in the interior (12), which variable volume occurs with a change in position of the volume compensation element (11) relative to the carrier plate (7). A gap between the volume compensation element (11) and the carrier plate (7) is connected to the external atmosphere.
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