Semiconductor stacked body, method for manufacturing same, and semiconductor element

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United States of America Patent

PATENT NO 9153648
APP PUB NO 20140048823A1
SERIAL NO

14110417

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Abstract

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A method for manufacturing a semiconductor stacked body, and a semiconductor element including the semiconductor stacked body includes a semiconductor stacked body, including a Ga2O3 substrate having, as a principal plane, a plane on which oxygen atoms are arranged in a hexagonal lattice, an AlN buffer layer formed on the Ga2O3 substrate, and a nitride semiconductor layer formed on the AlN buffer layer.

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Patent Owner(s)

Patent OwnerAddress
TAMURA CORPORATION1-19-43 HIGASHI-OIZUMI NERIMA-KU TOKYO 1788511
KOHA CO LTD6-8 KOUYAMA 2-CHOME NERIMA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iizuka, Kazuyuki Tokyo, JP 33 311
Kuramata, Akito Tokyo, JP 22 350
Morishima, Yoshikatsu Tokyo, JP 11 147
Sato, Shinkuro Tokyo, JP 7 8

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