Heat pipe for cooling optical sources
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United States of America Patent
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Oct 6, 2015
Grant Date -
Aug 20, 2015
app pub date -
Feb 15, 2014
filing date -
Feb 15, 2014
priority date (Note) -
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Abstract
Embodiments generally relate to heat pipes and methods for fabricating the same. In one embodiment, the heat pipe comprises a first section bonded to a second section such that a first channel is enclosed therebetween; and a liquid partly filling the first channel. The bonded first and second sections comprise a first area configured to be bonded to a heat-generating device and a second area configured to be bonded to a heat sink. The first channel is characterized by a first portion within the first area and a second portion within the second area. The liquid and at least one of the first section and the second section are transparent at a wavelength emitted by the heat-generating device.
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