Fusing method of substrate layer, manufacturing method of microfluidic chip and fusing apparatus of substrate layer
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United States of America Patent
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Oct 6, 2015
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Oct 29, 2012
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Nov 7, 2011
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Abstract
Provided is a fusing method of a substrate layer including: treating a joining surface of a substrate layer formed from a resin using an organic solvent having solubility with respect to the resin; and heating the treated substrate layer at less than a glass transition temperature or a softening point temperature of the resin and crimping the heated substrate layer.
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