Reactive contacts for 2D layered metal dichalcogenides
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United States of America Patent
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Sep 29, 2015
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app pub date -
May 8, 2014
filing date -
May 8, 2014
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Abstract
Techniques for forming metal contacts to LMDC-based devices are provided. In one aspect, a method of forming a metal contact to a LMDC semiconductor material includes the steps of: depositing a contact metal onto the LMDC semiconductor material; and annealing the LMDC semiconductor material and the contact metal under conditions sufficient to react the contact metal with the LMDC semiconductor material and thereby form a buffer layer as an interface between the contact metal and the LMDC semiconductor material that compositionally is a transition from the LMDC semiconductor material to the contact metal and connects the LMDC semiconductor material and the contact metal by covalent bonds. The LMDC semiconductor material can be a material having a formula MX2, wherein M is a metal, and X is a chalcogen. A LMDC-based device and techniques for forming the device are also provided.
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