Integrated circuit system employing alternating conductive layers
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United States of America Patent
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Sep 29, 2015
Grant Date -
Jan 7, 2010
app pub date -
Jul 7, 2008
filing date -
Jul 7, 2008
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Abstract
An integrated circuit system that includes: providing a substrate including front-end-of-line circuitry; forming a first conductive level including a first conductive trace over the substrate; forming a second conductive level spaced apart from the first conductive level and including a second conductive trace; and connecting the first conductive level to a third conductive level with a viabar that passes through the second conductive level without contacting the second conductive trace.
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