Flip chip MLP with conductive ink

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United States of America Patent

PATENT NO 9147627
APP PUB NO 20100052127A1
SERIAL NO

12616943

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Abstract

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A flip chip molded leadless package (MLP) with electrical paths printed in conducting ink. The MLP includes a pre-molded leadframe with the electrical paths printed directly thereon. The present invention also provides a method of fabricating the semiconductor package.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR COMPONENTS INDUSTRIES LLC5701 N PIMA ROAD SCOTTSDALE AS 85250

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Seung-Yong Seoul, KR 19 291
Estacio, Maria Cristina B Relau, MY 29 840
Shian, Ti Ching Georgetown, MY 4 111

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