Method of forming an insulator layer in a semiconductor structure and structures resulting therefrom
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United States of America Patent
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Sep 29, 2015
Grant Date -
Nov 10, 2011
app pub date -
Nov 9, 2010
filing date -
May 7, 2010
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Abstract
An electronic system, method of manufacture of a semiconductor structure, and one or more semiconductor structures are disclosed. For example, a method of manufacture of a semiconductor structure is disclosed, which includes forming a first semiconductor substructure over a semiconductor substrate, forming a first spacer layer over the first semiconductor substructure and the semiconductor substrate, and forming a second semiconductor substructure over at least a portion of the first spacer layer.
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