Apparatus for liquid treatment of wafer shaped articles
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United States of America Patent
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Sep 29, 2015
Grant Date -
Apr 10, 2014
app pub date -
Oct 10, 2012
filing date -
Oct 10, 2012
priority date (Note) -
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Abstract
Apparatus for processing wafer-shaped articles comprises a chuck adapted to hold a wafer-shaped article of a predetermined diameter during a processing operation to be performed on the wafer-shaped article. The chuck comprises a chuck body having an outer surface that faces a wafer-shaped article when positioned on the chuck. The outer surface comprises a first electrically conductive material and the chuck body further comprises a first conductive pathway between the first conductive material and ground.
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