Efficient cooling of piezoelectric transducers
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United States of America Patent
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Sep 22, 2015
Grant Date -
Apr 10, 2014
app pub date -
Oct 10, 2012
filing date -
Oct 10, 2012
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Abstract
A sealed piezoelectric transducer having a single, uniform, electrically insulating, heat-conducting layer of a soft, rubbery material filled with a fine, homogeneously-dispersed powder having high thermal conductivity. The material is placed in contact with the surfaces of the transducer and conducts the heat from the surfaces to an external heat sink. Since the thermally conductive powder is fully encapsulated in the rubbery material, its abrasive properties are neutralized. The softness of the material ensures that the vibration of the transducer does not transmit significant acoustic energy into the material, thereby avoiding the generation of parasitic heat. In addition, the layer fills the entire gap between the transducer and the heat sink, thereby removing any possibility of moisture-related arcing.
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