Light-emitting diodes on a wafer-level package
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United States of America Patent
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Sep 22, 2015
Grant Date -
May 14, 2015
app pub date -
Nov 11, 2013
filing date -
Nov 11, 2013
priority date (Note) -
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Abstract
A light emitter and methods of constructing the same is disclosed. The light emitter is disclosed as including a jumper chip and one or more light sources, such as Light Emitting Diodes (LEDs). The light sources are connected to the jumper chip via conductive traces manufactured with semiconductor processing techniques. The jumper chip is disclosed as having a plurality of isolated conductive vias, thereby allowing the jumper chip to present multiple different bonding areas that are electrically isolated from one another.
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