Optoelectronic package and method for making same
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United States of America Patent
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Sep 22, 2015
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app pub date -
Apr 11, 2013
filing date -
Apr 12, 2012
priority date (Note) -
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Abstract
An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.
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