Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer
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United States of America Patent
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Sep 22, 2015
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app pub date -
Apr 24, 2013
filing date -
Apr 24, 2012
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Abstract
[Problem] Provided is a technique for bonding chips efficiently onto a wafer to establish an electrical connection and raise mechanical strength between the chips and the wafer or between the chips that are chips laminated onto each other in the state that resin and other undesired residues do not remain on a bond interface therebetween.
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