Lead pin for package substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9142499
APP PUB NO 20140291851A1
SERIAL NO

14302045

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MACHANICS CO LTD314 MAETAN 3-DONG YEONGTONG-GU SUWON GYUNGGI-DO 443-743

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Jin Won Yongin, KR 40 279
Jeong, Sung Won Yongin, KR 39 328
Lee, Gi Sub Busan, KR 5 9
Lee, Ki Taek Seoul, KR 14 66
Oh, Hueng Jae Suwon, KR 10 51

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Mar 22, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00