Semiconductor devices having stacked solder bumps with intervening metal layers to provide electrical interconnections

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United States of America Patent

PATENT NO 9142498
SERIAL NO

13917000

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Abstract

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An electrical interconnection can be provided using a bump stack including at least two solder bumps which are stacked on one another and at least one intermediate layer interposed between the at least stacked two solder bumps.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kwon, Yonghwan Suwon-si, KR 43 820
Noh, Boin Suwon-si, KR 8 25
Park, Sun-Hee Seoul, KR 26 255

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