Lead frame and semiconductor package manufactured by using the same
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United States of America Patent
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Sep 22, 2015
Grant Date -
Oct 30, 2014
app pub date -
Dec 3, 2012
filing date -
Dec 12, 2011
priority date (Note) -
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Abstract
The present invention provides a lead frame having excellent solder wettability and solderability, that is well-bonded to a copper wire, and manufactured with low cost, and a semiconductor package manufactured by using the same. The lead frame includes: a base material; a first metal layer formed on at least one surface of the base material, the first metal layer comprising nickel; a second metal layer formed on a surface of the first metal layer, the second metal layer comprising palladium; and a third metal layer formed on a surface of the second metal layer, the third metal layer comprising silver.
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