Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device
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United States of America Patent
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Sep 22, 2015
Grant Date -
Apr 9, 2009
app pub date -
Dec 3, 2008
filing date -
Aug 30, 2004
priority date (Note) -
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Abstract
A method of producing a carrier structure for fabricating a stacked-type semiconductor device includes laminating thin plates for a lower carrier associated with an upper carrier. The method includes forming openings in the thin plates by etching or electric discharge machining. The lower carrier includes a magnet that is buried therein and the magnet maintains contact between the lower carrier and the upper carrier. A thin plate of the laminated thin plates is provided on each opposing surface of the magnet. The lower carrier further includes multiple magnets arranged around a periphery of the lower carrier and through a center region of the lower carrier that is between magnets on the periphery.
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