Photoimaging
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United States of America Patent
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Sep 15, 2015
Grant Date -
Nov 28, 2013
app pub date -
Nov 11, 2011
filing date -
Nov 23, 2010
priority date (Note) -
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Abstract
There is herein described a method and apparatus for photoimaging. More particularly, there is described a method and apparatus for photoimaging a substrate (e.g. a web) covered with a wet curable photopolymer wherein a rotatable phototool is pressed and rotated against the substrate to create an imaged substrate which is used to form images suitable for forming electrical circuits such as for printed circuit boards (PCBs), flat panel displays and flexible circuits. There is also described a method and apparatus for directly photoimaging a substrate covered with a wet curable photopolymer, wherein the photoimaged substrate is used to form images such as electrical circuits and a method and apparatus for exposing at least part of a solder mask on a printed circuit board (PCB) using a wet curable photopolymer wherein an imaging process may thereafter occur on the area above the solder mask.
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