Process condition measuring device (PCMD) and method for measuring process conditions in a workpiece processing tool configured to process production workpieces
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United States of America Patent
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Sep 15, 2015
Grant Date -
Aug 9, 2012
app pub date -
Feb 3, 2011
filing date -
Feb 3, 2011
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Abstract
A process condition measuring device (PCMD) may include first and second substrate components. One or more temperature sensors are embedded within each substrate component. The first and second substrate components are sandwiched together such that each temperature sensor in the second substrate component is aligned in tandem with a corresponding temperature sensor located in the first substrate component. Alternatively first and second temperature sensors may be positioned in parallel in the same substrate. Temperature differences may be measured between pairs of corresponding temperature sensors when the PCMD is subjected to process conditions in a workpiece processing tool. Process conditions in the tool may be calculated from the temperature differences.
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