Surface mountable semiconductor bridge die
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United States of America Patent
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Sep 15, 2015
Grant Date -
Oct 14, 2010
app pub date -
Apr 6, 2010
filing date -
Apr 13, 2009
priority date (Note) -
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Abstract
A semiconductor bridge die may have an “H-design” or “trapezoidal” configuration in which a center bridge segment is flanked by one or more angled walls on each side of the bridge segment. Each wall is plated with a conductive material, thereby providing a continuous conductive path across the top surface of the die. A bottom surface of the die may be connected to a top surface of a header by epoxy in various configurations. The plated angled walls facilitate the solderable connection of the walls to a plated top surface of each of several pins on a top surface of the header, thereby providing a continuous electrical connection between the pins and the die. Also, a method is provided for manufacturing a semiconductor bridge die in accordance with the various embodiments of the die.
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