Cylinder plating method and device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 15, 2015
Grant Date -
Jun 27, 2013
app pub date -
Sep 27, 2011
filing date -
Sep 30, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided are a plating method and a plating apparatus for a cylinder, which are capable of forming a plating layer having a uniform thickness in a technology of plating a cylinder, effectively preventing current concentration in cylinder end portions when being combined with a plating technology using divided insoluble electrodes, and performing plating with a more uniform thickness over the full length of a cylinder without generating defects such as rashes and pits irrespective of the size of the cylinder. The insoluble electrode has a shape in which a lower part thereof is curved inward, and is capable of rotating about an upper end thereof. Further, a thickness of a plating layer on an outer peripheral surface of the cylinder is adjusted by controlling an interval of closeness to the cylinder.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2011 Application Filing Year
- C25D Class
- 430 Applications Filed
- 287 Patents Issued To-Date
- 66.75 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C25D Class
- 0 % this patent is cited more than
- 10 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 15, 2027 |
